Lead Frame

We provide high-precision lead frames designed to facilitate the support, heat dissipation, and external connectivity of semiconductor chips.
Our products are engineered with the mechanical strength required to protect components from physical stress
while maintaining the high electrical and thermal conductivity necessary for efficient performance.
Our lead frames are manufactured with materials such as Copper Alloys and Nickel Alloys like Alloy 42 for high-reliability applications.
Our manufacturing capabilities include both precision stamping for high-volume production and chemical etching for intricate, high-density designs