Cantilever Probe Card Pin

Wafer Process

High-Performance Tapered Probe Technology

概要

High-Performance Tapered Probe Technology

We provide high-precision tapered probe card pins engineered for the most demanding semiconductor testing requirements.
By utilizing a proprietary mechanical grinding process instead of conventional etching, we achieve superior tip accuracy
and the ability to process specialized precious metal materials including
Tungsten (W), Rhenium Tungsten (ReW), Palladium Alloy (Pd), and Beryllium Copper (BeCu)
Our fully integrated in-house production covering everything from wire drawing
and heat treatment to final bending and allows us to deliver custom-tailored solutions with
optimized material properties for maximum reliability and performance.