Wire Contact Probe

Wafer Process

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Wire probe Solution for Vertical Probe Card & PCB Testing

概要

Wire probe Solution for Vertical Probe Card & PCB Testing

Our Wire Probe is a high-precision inspection solution designed specifically for the
rigorous testing of electronic components with narrow-pitch electrodes
and highly integrated area arrays. Our ultra-fine wire probes excel in space-constrained environments,
offering conductor diameters ranging from 0.02mm to 0.110mm and total lengths as short as 4.5mm.
We utilize a variety of specialized conductors, including tungsten, beryllium copper, and palladium alloys, to
ensure stable contact resistance and high oxidation resistance, which is critical for semiconductor
wafer and IC package board inspections. Furthermore, our proprietary manufacturing process applies a sharp,
insulated coating interface with enhanced surface lubricity, providing the durability and electrical
reliability required for advanced continuity testing and Kelvin resistance measurements.

Features

Both sockets and contact probes are manufactured
in house.

Cost savings on replacement sockets
Probes and common socket parts can be built in
larger quantities and stocked for future use.

Precise Machining Capability
Φ0.12 holes for 0.15 pitch on Ceramics is available.